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Skype: bruseguo
contact us 86-75523573370
+86-15889772429
Email us: bruse@mokotechnology.com.cn

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Phone:

86-75523573370

Email: bruse@mokotechnology.com.cn

Fax:86-75523573370-803

Address: 4F,Buidling2,Guanghui Technology Park,MinQing Rd,Longhua,SZ 518109,China

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BGA Assembly Services, Ball Grid Assembly Services
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BGA Assembly Services, Ball Grid Assembly Services

  • Introduction:MOKO works with BGA (Ball Grid Array) assembly services and one stop destination for all your BGA assembly services, we has been providing BGA assembly, BGA rework and BGA Reballing services in EMS industry for over 10 years. With state-of-the-art BGA placement equipment, correct BGA assembly processes and X-ray test equipment, you can rely on us to build high quality and good yield rate BGA boards.
  • Hotline:86-75523573370
  • Detail

The Premier Destination for BGA Assembly Services In China

When MOKO PCB Assembly starting doing BGA assembly on year 2001, there is not many company play with this new technology yet.
MOKO Technology Latd has immense expertise and expericence in Ball Grid Array (BGA) assemblies. We provide BGA assembly services that are well-known among clients for producing quality circuit boards with precision component placement and soldering excellence.

BGA Assembly Service Features

We offer the entire gamut of Assembly services for BGAs, including:

    Ceramic BGA (CBGA)
    Plastic BGA (PBGA)
    Micro Fine Line BGA (MBGA)
    Micro BGA
    Stack BGAs
    Leaded and Lead free BGAs
We provide these with ultra-fine pitch quad flat packages (QFP), Quad Flat No Lead Package (QFN), and Chip Scale Packages (CSP). We analyze BGA data sheets, BGA size and ball material composition. We optimize the thermal profile of the BGAs to improve the quality of the assembly process.

We utilize the latest equipment in automated Surface Mount Technology (SMT) assembly to help us meet this goal:

    Automated Placement Machines
    Automatic Solder Dispensing Machine
    Reflow Oven
    X-ray and AOI Inspection Systems
    Specialized Inspection Systems for solder ball height and coverage
An ESD and climate controlled environment is also utilized to ensure that the finished products meet all standards of efficiency, reliability, and quality.

Review and Rework Services

Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. Our BGA rework process comprises:

    Component removal
    Preparing the rework area
    Solder paste application
    Replacement of BGA
    Reflow of circuit board

Our rework processes are guaranteed to protect the circuit board from any future damage.
Moko can even working with board which has 6 BGAs on top side and bottom side, that is not challenge enough, we also can work both Lead Free BGA and Leaded BGA at same circuit board.

MOKO Technology Ltd  located in ShenZhen, China. Tel: 86-75523573370
Please send email for quote to  bruse@mokotechnology.com.cn


  • Contact Us

MOKO Technology Limited

Phone:86-75523573370

Fax:86-75523573370-803

Email:bruse@mokotechnology.com.cn

Address:4F,Buidling2,Guanghui Technology Park,MinQing Rd,Longhua,SZ 518109,China




* RequirePurchase:BGA Assembly Services, Ball Grid Assembly Services