Welcome to MOKO Technology Limited

Skype: bruseguo
contact us 86-75523573370
Email us: bruse@mokotechnology.com.cn

  Printed Circuit Board Assemblies (PCBAs)

Printed Circuit Board Assemblies (PCBAs)

Focused on meeting the unique needs of customers requiring advanced PCB assembly and testing. We have invested in leading technology and skills to ensure customers can access cost-effective solutions using the latest technologies. 

Production services are flexible enough to handle low-to-high volume requirements or high and low-mix products with efficiency. From design through assembly and test, quality is a top priority. Assembly and inspection follows the IPC-A-610 requirements for either leaded or RoHS compliant production. 

Capabilities Include: Complex double-sided, Ball Grid Array (BGA), Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. 
PCB assembly - surface mount assembly including 0402 and BEA MBEA placement and ball grid array (BGA) on multiple lines

  • Automatic optical inspection (AOI)
  • BGA Rework Stations
  • X-Ray Inspection
  • EMC and environmental testing
  • Pb-Free, RoHS Capable
  • Full Backup Power Coverage
  • Cable loom and cabinet wiring
  • Burn-in and environmental testing

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