BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Devamını oku: BGA PCB Meclisi
#PCB Montajı
hepimizin bildiği gibi, flex PBC is flexible. I am curious about the reliability of vias in it. Is it easy to break?
I want to desolder a tiny surface mount button from the motherboard of a phone. There are a lot of similarly tiny components surrounding it that I do not want to damage with heat from the soldering iron. Can I use aluminium foil in lieu of kapton tape to protect these components?
Üreticinin PCB tasarımcısından bir BOM talep ettim, ama bana bir Gerber gönderdi. Bunu nasıl açıp okuyabilirim?
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