Hoho'a no te PCB
PCB prototype is a crucial stage in product development. It enables the reduction of the risk of costly rework during mass production.
A variety of different kinds of printed circuit board prototypes can be manufactured to your requirements, whether single or double-sided PCB, blind or buried via boards, boards made with unique materials or rigid-flex PCB and rigid PCB with burn-in board testing. MOKO Technology can bring your design idea to fruition.
Ma te 5 STM lines, 3 DIP production lines and flexible lead time, PCB prototype fabrication of over 50 layers can be accomplished by MOKO Technology in 24 mau hora.
PRM (Hoho'a no te hamani i te hamaniraa) service can also be provided by MOKO Technology. Experienced engineers will provide you with an optimized blueprint, which does not exist possible manufacturing problems. While the function and project integrity meet your compliance requirements, complications are eliminated quickly while removing the need for costly product rework.
Whether you choose our PCB prototype service with DFM or use your own design instead, all of the boards will be tested to ensure it can be applied in your projects. All orders can be tracked using our ERP system. Our rates are transparent, so you will not be charged extra costs.
PCB Prototype Advantages
- All possible design flaws can be detected at the outset of your project. This can save your time and money before the flaws result in extra rework and costs during mass production.
- With less cost-spending when compared with the high-volume orders, Prototype gives you a clear blueprint with respect to how small tolerance and strict quality can be controlled. Te mau nota, it’s a wise decision to ensure the perfection of standard PCB.
- Rapid and flexible lead times allow you to receive the PCB prototype board faster, which can expedite the processing of your project.
Order and Track Your Prototype PCB
When you contact us to provide your design on Gerber files, along with a BOM, our engineer team will evaluate the design and offer you the quotation.
Once you contact us, whether at the quote or delivery stage, all of the project processes will be updated by our sales team and engineers. Our ERP system is currently running, once we’ve confirmed that there are no issues during the ERP system, it will be open online to track your order by yourself in real-time.
The Specification of PCB Prototype from MOKO Technology
|Quality Grade||Standard IPC 2|
|Materia||TE MAU RAVEA-1, TE 2 no TE MAU FAUFAA, TE 4 no TE MAU FAUFAA, TE mau rave'a no te mau tau e te mau hau e te mau tau e te mau, CEM-1, CEM-3, TT IG, Nehenehe e rave i te mau mea e au i te|
|Available Layers||1~50 layers|
|Te maraa rahi o te tomite faatere (mm)||0.2mm~7mm|
|Te îraa o te tomite faatere||±0.1mm - ±10%|
|Board Side||Min 6*6mm | Max 500*500mm|
|Board Size Tolerance||±0.1mm - ±0.3mm|
|Te maraa rahi o te kopa||0.5-4.0hoe ha'u|
|Copper Thickness Tolerance||+0μm +20μm|
|Te faito veo||0.5hoe ha'u - 6.0hoe ha'u|
|Inner Layer Copper Weight||0.5hoe ha'u - 2.0hoe ha'u|
|Minuti. Rahi o te apoo i haapiihia||0.25mm|
|Minuti. Te aanoraa o te reni||0.075mm (3te mili)|
|Minuti. Te taa-ê-raa o te reni||0.075mm (3te mili)|
|Surface Treatment||Utuhiraa i te auro, HALS/HALS e arata'i ti'amâraa, Te ete o te mau moa, Auro o te mau moa|
|Surface/Hole Plating Thickness||20tai'o mahana - 30tai'o mahana|
|Area no te mana'o tûta'u||TE MAUTH: ±0.075, NTPH: ±0.05|
|Û tapo'i o te taata hoo||Green/Black/White/Red/Blue/Yellow|
|Solder Mask Sides||Mai te au i te putu'ite|
|Te mau pae o te tirita||Mai te au i te putu'ite|
|Te peni Silkscreen||Uouo, Ninamu, Ereere, Uteute, Re'are'a|
|Min Annular Ring||3te mili|
|Min Width of Cutout (NPTH)||0.8mm|
|NPTH Hole Size Tolerance||±.002" (±0.05mm)|
|SM Tolerance (LPI)||.003" (0.075mm)|
|Faito hi'oraa||1.10 (Rahi o te apoo: Tabula ohipa)|
|PCB Testing||10V - 250V, flying probe or testing fixture|
|Te farii - noa - raa i te mau mea atoa||±5% - ±10%|
|SMD Pitch||0.2mm (8te mili)|
|BGA Pitch||0.2mm (8te mili)|
|Chamfer of Gold Fingers||20, 30, 45, 60|
|Solder Mask Bridge||0.1mm|
|Minimum Trace / Taa-ê-raa||3mil/3mil|
|Minimum trace width in inner layers||≥ 6 mil To prevent ion migration|
|Minimum distance between vias (plated holes)||12 ml or higher Prevent ion migration|
|Minimum distance between plated holes and trace||≥ 12 mil To prevent ion migration|