- Cargo pallet
- ESD cotton bag to avoid chip damage
- Bubble wrap to buffer the board from accident press
- Dry PCB before packing
Read More: Logistics
#PCB Assembly
Read More: Logistics
#PCB Assembly
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
I’m using some 0.1% precision 10k and 150k resistors. They are thin film 0603 surface mount. For a lot more, there are also thick film types. Fundamentally and practically, what is the difference between these two?
I usually work for PCB designing and know some useful design software. I want to know what design software you are using. Is there any high recommendation?
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