I am designing a system on megahertz frequency bands (~ 400-1000MHz.) This device is connected to a variable antenna which does not necessarily stay in match with the circuit so there will be some reflection of the power back to the circuit. The feeding power would not be more than 0dBm at maximum. Do I ever need to take care of the reflections at all?
I have a set of LED driving lights for motorcycle that must be wired through a ground-leg pulse width modulation dimmer. The problem is the mounting bracket for the lights is grounded, so the lamp shorts to ground through the motorcycle chassis and the PWM dimmer cant dim the lamps. How do I handle this problem?
In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?
The PCB has a pulse oximeter mounted on the surface, and it’s tolerance is 0.6mm. The problem is the pulse oximeter needs to touch the bottom case at all times. How to best mount the PCB in the case without putting too much stress on the pulse oximeter? Will screws with flexible washers be all right? Sadly separating pulse oximeter from main PCB is not an option.
I have a PCB that was poorly designed and there is a ground pad that is too close to a signal pad. As a result, the signal pad on the surface mount component will short to ground. I was looking to use some ink or other material to cover the ground pad. The pads are too small to fit Kapton tape. Are there any standard materials used to cover PCB SMT pads?
I’m designing a new PCB where I have a whack of connectors that have to line up with the metalwork. There are some problematic connectors. All 4 pins are round. I want to have the holes as small as possible while allowing for good solder adhesion over the full length of the pin. I’m looking for guidance on how much clearance around the component lead I should have in order to get good solder wetting and adhesion.