2-16 layer hdi multi-layer pcb
Product Description
This 2-16 layer hdi multi-layer PCB is built with advanced routing, fine traces, microvias, and buried vias, featuring excellent signal integrity, minimized EMI, and compact layouts. Therefore, it is very suitable in applications that has limited space but require high functionality and reliability such as mobile devices, medical equipment, and automotive systems.
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| Layer Counts | 2-16 layers |
| Base Material | FR-4, Rogers and Megtron laminates are optional |
| Board Thickness(mm) | 2.4mm |
| Max board size(mm) | 570*670mm |
| PCB size tolerance | ±0.2-0.3mm |
| Min. Hole Size | 0.1mm |
| Min. Line Width | 4mil |
| Copper Weight | 2oz |
| Surface Finish | ENIG, HASL, OSP are available |
| Certificate | UL, IPC-6012, RoHS, ISO 9001, ISO14001 |
2-16 layer hdi multi-layer pcb
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Frequently Asked Questions
An HDI (High Density Interconnect) multi-layer PCB is a circuit board that uses microvias, blind vias, and buried vias to achieve higher component density and shorter trace lengths compared to traditional PCBs.
They support quick signal transmission, prevent much signal loss and electromagnetic interference, increase the heat dissipation of the board and allow for creating more advanced circuits without making the board larger.
The 2-16 layer hdi multi-layer PCB can be constructed from FR-4, Rogers and Megtron laminates.
Absolutely. We specialize in laser-drilled microvias, buried vias, blind vias, and impedance is controlled within +/-5% in order to suit high-frequency circuitry.
We offer turnkey PCBA ranging from component sourcing (from our partnered distributors or your BOM), bare board manufacturing, PCB assembly and quality checks.
We ship globally via DHL, FedEx, UPS, and other logistics partners. Shipping typically requires 3 to 7 days, which is decided by your geographical location.
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