We prefer cathode on the left, as per the standard, but typically rely on silkscreen or customer input to determine the proper orientation.
Read More: PCB Layout Services
#PCB Assembly
We prefer cathode on the left, as per the standard, but typically rely on silkscreen or customer input to determine the proper orientation.
Read More: PCB Layout Services
#PCB Assembly
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
This question is about the advisability of continuing to use a USB mini-B right angle surface mount connector in my pcb designs. On occasion we see one of these connectors peel back or delaminate off the pcb. Immediately the question is asked, why didn’t you use a through hole connector?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
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