What is the proper zero orientation for a SMT LED?

According to IPC-7351, the cathode should be on the left for a molded diode. However, when I use component wizard of my suppliers to create a diode, it places the cathode (K) on the right. Does it depend on the manufacturer? How does the assembly house know which way is correct?

We prefer cathode on the left, as per the standard, but typically rely on silkscreen or customer input to determine the proper orientation.

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Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.
Oliver Smith

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

What Others Are Asking

How can I handle missing solder mask opening on PCB footprint?

I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?

Do you use SMT or THT for USB mini B connector?

This question is about the advisability of continuing to use a USB mini-B right angle surface mount connector in my pcb designs. On occasion we see one of these connectors peel back or delaminate off the pcb. Immediately the question is asked, why didn’t you use a through hole connector?

Can leaded BGA chips be reflow soldered with lead-free process?

I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?

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