Put a machined guard around the pulse oximeter to keep the surface from it at about 0.2-0.3 (if it is and SMD part soldering height tolerance is about 0.2mm) and then simply screw down the resulting assembly.
Otherwise use weak springs to push the p.o. against the case, need to know the allowed stress on the body for that.
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I’m working on a project which requires the use of a CSP package. The product’s datasheet provides ball pitch and ball diameter but nothing about the preferred land pad diameter.
How can the pad diameter be worked out from these figures assuming an NSMD land?
I know that using leaded process for lead-free BGA chips is not acceptable, because the solder balls of the BGA will not melt and the joint will be unreliable. But now BGA chip is only available in lead-free balls. is it ok to solder leaded BGA chips with a lead-free (thus, higher temperature) process?
Many assembly factories are asking for SMT jobs, while I think through hole would be a better option for a high voltage application. Before the high voltage project is started, we need to make a call on SMT or Through hole parts. Is there a study on this?
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