You can refer to the following table.
| Ball Dia. | Reduction | Land Pattern Density Level | Land Dia. | Land Variation |
| 0.15 | 15% | C | 0.13 | 0.15-0.10 |
| 0.20 | 15% | C | 0.17 | 0.20-0.14 |
| 0.25 | 20% | B | 0.20 | 0.20-0.17 |
| 0.30 | 20% | B | 0.25 | 0.25-0.20 |
| 0.35 | 20% | B | 0.30 | 0.35-0.25 |
| 0.55 | 25% | A | 0.40 | 0.45-0.35 |
Read More: BGA PCB Assembly
#PCB Design
I designed a PCB with an imaging sensor that is mechanically coupled to a lens assembly using four 2-56 screws. I’m noticing that even though the screws are holding the board tightly against the mechanical structure if I flick or lightly knock the the assembly the image “moves”. I’m hoping to get a few suggestions for ways to fix the PCB to the mechanical structure. Any suggestions for adhesives or the like? Something else?
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
A design engineer told me our PCB prototypes would be completed soon and then he would have his assembler “run a panel”. Does anyone know what that means?
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