Was ist der Prozess des PCB Reverse Engineering??

Ryan ist der leitende Elektronikingenieur bei MOKO, mit mehr als zehn Jahren Erfahrung in dieser Branche. Spezialisiert auf PCB-Layout-Design, elektronisches Design, und eingebettetes Design, Er erbringt elektronische Design- und Entwicklungsdienstleistungen für Kunden in verschiedenen Bereichen, aus IoT, LED, zur Unterhaltungselektronik, medizinisch und so weiter.
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Was ist der Prozess des PCB Reverse Engineering??

Unter PCB Reverse Engineering versteht man den Prozess der Analyse und des Verständnisses des Designs, Layout, und Funktionalität einer Leiterplatte durch Zerlegen, Untersuchung seiner Bestandteile, seinen Zusammenhängen nachspüren, and creating a PCB schematic or layout diagram without having access to the original design documents or plans. PCB-Reverse-Engineering wird häufig aus verschiedenen Gründen durchgeführt, including understanding how a competitor’s product works, recreating a discontinued or obsolete PCB for repair or modification, or assessing the security vulnerabilities of a device. In diesem Blogbeitrag, we will provide an overview of the PCB reverse engineering process step by step so you can better understand it. Lassen Sie uns gleich eintauchen.

The Process of PCB Reverse Engineering

Schritt 1:

Obtain the target PCB. Document layout by photographing and diagramming all component positions, orientations, and details on paper, especially diodes, Transistoren, and IC gaps. Take clear, well-lit photos of the full board for reference. As PCBs get more complex and miniaturized, tracing copper visually aids component identification.

Schritt 2:

Remove all components by desoldering. Clean the board thoroughly with isopropyl alcohol removing all debris before scanning. Scan at 600+ dpi after gently polishing copper layers to make them shiny. Scan the top and bottom layers separately in high-resolution color, with the board completely flat to the scanning surface.

PCB Reverse Engineering

Schritt 3:

Import scans to Photoshop. Adjust levels until copper traces are highly visible and distinct from the substrate. Convert the bottom layer to black-and-white and review closely to ensure the scan captured all tracings sharply without disconnections. Save optimized layers as BMP files named “TOP” and “BOTTOM”. Use software to fix any trace defects evident in the scans.

Schritt 4:

Open BMP files in PCB design software. Convert to native format. Use alignment tools to overlay pad holes, Wege, and matching points between layers precisely. Significant deviation indicates restart at an earlier stage is required for accuracy.

Schritt 5:

Start with the top layer scan. Trace out all visible design elements to recreate layer, matching component placements to earlier documentation photographs. Route connections following scans to replicate copper traces electrically. Delete the scan layer after finishing the vector trace. Repeat the process for the bottom scan layer, using connectivity tools to validate connections between layers. Add filled zones for any internal ground/power planes. For tight mehrschichtige Platten, enable transparency display modes with alignment guides for matching vias between layers.

Schritt 6:

Print 1:1 top silkscreen and bottom layer films. Carefully overlay these onto the target PCB, backlit to check for perfectly matched alignment of all elements vs actual boards. Fix any errors by further trace modifications until full validation is achieved.

Schritt 7:

With form and function accurately captured and verified match to original, printed circuit board reverse engineering process completes. Further test populated boards built from the reconstructed data to benchmark for electrical parity and validation of true functional duplication.

Benefits of Printed Circuit Board Reverse Engineering

Allows for remanufacturing of obsolete PCBsReverse engineering can re-create discontinued PCBs that lack support from the original equipment manufacturer. This makes it possible to repair and continue using equipment that otherwise would be completely unusable.

Facilitates PCB repairsBy understanding the design and components of a PCB through reverse engineering, faults can more easily be diagnosed and components replaced to repair damaged boards.

Enables custom modifications or improvementsWith the schematics and an understanding of a PCB’s design via printed circuit board reverse engineering, engineers can suggest and implement modifications like adding new features or enhancing performance.

Lowers costs of replication for small production runsReverse engineering allows cloned PCBs to be created without the high initial engineering and prototyping costs, making small scale production more affordable.

Provides insight for interoperability designPrinted circuit board reverse engineering can analyze the inner workings of competitors’ products which then influences improved interoperability design.

Facilitates technological progressWhile respecting intellectual property rights, responsible reverse engineering allows close study of innovative designs, spreads know-how, and fuels further creativity.

MOKO Provides Reliable PCB Reverse Engineering Service

MOKO Technology hat fast 20 langjährige Erfahrung in der Leiterplattenindustrie, besides PCB-Design und Montage, we also provide reverse engineering services. With in-depth analysis, we recreate discontinued boards, clone existing ones lost to obsolescence, or upgrade units to modern standards.

It’s important to note that while reverse engineering can be legal under certain circumstances, it might infringe on intellectual property rights or breach contractual agreements in some cases. Deshalb, it’s crucial to thoroughly assess and understand the legal ramifications associated with this process. Our process legally remanufactures your PCB while respecting intellectual property boundaries. Before commencing work, we thoroughly vet projects to guarantee no rights infringement. This allows us to provide fully functional replacements that can repair, replicate, or enhance the capacity of your outdated electronics. Contact our team to kickstart your custom project today.

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Ryan ist der leitende Elektronikingenieur bei MOKO, mit mehr als zehn Jahren Erfahrung in dieser Branche. Spezialisiert auf PCB-Layout-Design, elektronisches Design, und eingebettetes Design, Er erbringt elektronische Design- und Entwicklungsdienstleistungen für Kunden in verschiedenen Bereichen, aus IoT, LED, zur Unterhaltungselektronik, medizinisch und so weiter.
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