BGA stands for Ball Grid Array. It is a style of component footprint. These footprints appear as a rectangular array of small circles – one where each “ball” of the component is attached.
There will generally be a rectangular outline around the array that corresponds to the edges of the component’s package, and probably also some silkscreen (written) information identifying the component.
Read More: BGA PCB Assembly
#PCB Assembly
We found that edge-mounting a TO-Can package to a PCB will really save a lot on manufacturing. However, it comes with fairly long through-hole pins that are taking up too much space to reach the pads. Any suggestion?
All of the soldering I’ve done to this point has been with through-hole components. I hope to move up to some smaller surface-mount parts at some point in the future. I’ve got a Weller WES51 soldering station. There is a large number of ET series tips available. How do I choose the right tip for the components I’ll be working with?
I designed a PCB with an imaging sensor that is mechanically coupled to a lens assembly using four 2-56 screws. I’m noticing that even though the screws are holding the board tightly against the mechanical structure if I flick or lightly knock the the assembly the image “moves”. I’m hoping to get a few suggestions for ways to fix the PCB to the mechanical structure. Any suggestions for adhesives or the like? Something else?
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