PCB prototype is a crucial stage in product development. It enables the reduction of the risk of costly rework during mass production.
A variety of different kinds of printed circuit board prototypes can be manufactured to your requirements, whether single or double-sided PCB, blind or buried via boards, boards made with unique materials or rigid-flex PCB and rigid PCB with burn-in board testing. MOKO Technology can bring your design idea to fruition.
With 5 STM lines, 3 DIP production lines and flexible lead time, PCB prototype fabrication of over 50 layers can be accomplished by MOKO Technology in 24 hours.
DFM (Design for manufacturing) service can also be provided by MOKO Technology. Experienced engineers will provide you with an optimized blueprint, which does not exist possible manufacturing problems. While the function and project integrity meet your compliance requirements, complications are eliminated quickly while removing the need for costly product rework.
Whether you choose our PCB prototype service with DFM or use your own design instead, all of the boards will be tested to ensure it can be applied in your projects. All orders can be tracked using our ERP system. Our rates are transparent, so you will not be charged extra costs.
- All possible design flaws can be detected at the outset of your project. This can save your time and money before the flaws result in extra rework and costs during mass production.
- With less cost-spending when compared with the high-volume orders, Prototype gives you a clear blueprint with respect to how small tolerance and strict quality can be controlled. Still, it’s a wise decision to ensure the perfection of standard PCB.
- Rapid and flexible lead times allow you to receive the PCB prototype board faster, which can expedite the processing of your project.
When you contact us to provide your design on Gerber files, along with a BOM, our engineer team will evaluate the design and offer you the quotation.
Once you contact us, whether at the quote or delivery stage, all of the project processes will be updated by our sales team and engineers. Our ERP system is currently running, once we’ve confirmed ，no issues during the ERP system, it will be open online to track your order by yourself in real-time.
|Quality Grade||Standard IPC 2|
|Material||FR-1, FR-2, FR-4, FR4 Halogen Free, CEM-1, CEM-3, Hight TG, Aluminum|
|Available Layers||1~50 layers|
|Board Thickness (mm)||0.2mm~7mm|
|Board Thickness Tolerance||±0.1mm - ±10%|
|Board Side||Min 6*6mm | Max 500*500mm|
|Board Size Tolerance||±0.1mm - ±0.3mm|
|Copper Thickness Tolerance||+0μm +20μm|
|Copper Weight||0.5oz - 6.0oz|
|Inner Layer Copper Weight||0.5oz - 2.0oz|
|Min. Drilled Hole Size||0.25mm|
|Min. Line Width||0.075mm (3mil)|
|Min. Line Spacing||0.075mm (3mil)|
|Surface Treatment||Immersion gold Immersion, HALS/HALS lead free, Chemical tin, Chemical Gold|
|Surface/Hole Plating Thickness||20μm - 30μm|
|Hole Tolerance||PTH: ±0.075, NTPH: ±0.05|
|Solder Mask Color||Green/Black/White/Red/Blue/Yellow|
|Solder Mask Sides||As per the file|
|Silkscreen Sides||As per the file|
|Silkscreen Color||White, Blue, Black, Red, Yellow|
|Min Annular Ring||3mil|
|Min Width of Cutout (NPTH)||0.8mm|
|NPTH Hole Size Tolerance||±.002" (±0.05mm)|
|SM Tolerance (LPI)||.003" (0.075mm)|
|Aspect Ratio||1.10 (Hole size: Board thickness)|
|PCB Testing||10V - 250V, flying probe or testing fixture|
|Impedance Tolerance||±5% - ±10%|
|SMD Pitch||0.2mm (8mil)|
|BGA Pitch||0.2mm (8mil)|
|Chamfer of Gold Fingers||20, 30, 45, 60|
|Solder Mask Bridge||0.1mm|
|Minimum Trace / Spacing||3mil/3mil|
|Minimum trace width in inner layers||≥ 6 mil To prevent ion migration|
|Minimum distance between vias (plated holes)||12 ml or higher Prevent ion migration|
|Minimum distance between plated holes and trace||≥ 12 mil To prevent ion migration|