It means lC and component which is connected to Ground. If a Ground plane is made as a separate layer, all these pins are to be connected. It can boost the performance of circuitry in certain conditions.
Sometimes vias are used for connections to ground planes.
Read More: Types of PCB Layers and Optimization
#PCB Design
I have some PCBs that were wave soldered but the vias still remain open, they are not filled nor plugged form what I can see. I do not see any solder on the annular rings of the vias either. How do they go about doing so?
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
The assembly note states: Bake bare PCBs in a clean and well ventilated oven prior to assembly at 125*C for 24 hours. Why is this necessary?
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