C for capacitance. R for resistance. CR for capacitive reactance circuit.
Alternating current can pass through the capacitor. When the capacitor is connected to the AC circuit, the charge on the capacitor plate has a hindering effect on the directional moving charge, which is called the capacitive reactance.
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#PCB Assembly
I know the paste mask layer is also called the stencil layer. It’s only used for assembly. I want to know if the paste mask layer (both top and bottom layer) is necessary for through hole components. For SMD components I know the paste mask layer is required to solder the components. Is it necessary for through hole components?
I am a buyer in a telecom company. Recently, an important order of SMT PCBA is delayed due to insophiscated production of a supplier. I am thinking about replace it and just very puzzled about how did their SMT pad fall off easily when soldering the PCB boards. That slows down the whole process.
Is there a general rule as to how much clearance you should add to through-hole components’ holes to allow them to fit easily? For example, if I have a component with 1mm pin diameter, what should the diameter of the holes for it’s pads be?
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