The solder reflow heat mass is significantly greater in assembly line.
|Make by Yourself
|You may need some forced air for ramp-down and a thermal couple probe to “profile” a bare board to match the LED recommended ramp rates, peak liquidus dwell and cooling rates to prevent solder stress failures.
If you do not have thermal couples , estimate the liquidus point when a tiny blob of solder melts and the duration it is melted. and your overall profile time from the datasheet. Avoid too slow and too fast as the wire bond may shear inside.
|Assembly line process engineers do this with a thermally protected data collection module.
It slow down the conveyor speeds to absorb the higher heat mass as well as accelerate the temperature rise in the number of zones in their control. Too slow is a reliability issue for LEDs and the overall time to ramp up and down must not be exceeded for this reason.
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