“Zig zags” are used to ensure a group of traces are all the same length. It makes sure that signal from various paths arrives at roughly the same time, reducing latency and sync issues.
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#PCB Design #PCB Manufacturing
My small PCB is mounting a very sensitive fragile sensor on the top surface that has to be wire bonded to the PCB, so I am trying to design a smaller PCB that can be surface mounted to the bigger PCB. How can I get some kind of thin footprint for interconnecting the two PCB boards?
In the design of a power electronic PCB, I want to use a metal PCB for heat dissipation of a TO-220 package MOSFET. To do that I want to mount metal PCB on the MOSFET with the use of thermal paste and screw exactly like we do when we use heatsink for the same package. Should I leave the copper of PCB between MOSFET surface and dielectric of PCB or remove the copper surface and leave only the dielectric opening?
I am getting a PCB manufactured for a project that I am working on. One of the parts, the A4950 motor driver, has a “pad” on the bottom, which is meant to be soldered to GND of the PCB for thermal dissipation. I was thinking about the prototyping, and I am unsure how I would go about (using a soldering iron), soldering the pad on the bottom.
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