“Zig zags” are used to ensure a group of traces are all the same length. It makes sure that signal from various paths arrives at roughly the same time, reducing latency and sync issues.
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My teammate are designing an LED Board and confused by PCB heat sink problem. Is it on the back or the sides with copper traces? Is it on the anode and cathode pad or side copper traces?
I am designing a PCB that uses castellated edges to connect to the parent board. I would like to use hot air solder leveling finish to save on costs for prototyping, but I am concerned that the non-planar surfaces of the module may pose assembly issues. Is it common at all to use HASL for castellated boards, or do I need Electroless Nickel Immersion Gold to ensure successful assembly?
What I would like to know is if ICs also have a limited shelf life and if so, do some types suffer more than others?
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