Try not to make so long because your outer pinout is sensible. you should be able to do most of this on one layer. With a standard 5 mil trace/space process, you should have no problem fitting a trace between two pads. It should be possible to route that whole thing on one layer.
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Although the adsorption of moisture by FR4 is quite low, what is the best way to minimize it or eliminate it completely?
I have three through-hole PCBs that are missing front and back solder mask openings for two of the components. The solder mask (usually green) is covering the front and back solder pads. All other pads for all other parts are exposed. Is there a good way to remove the solder mask so that I can solder the components to the board?
I have a professional question about BGA package. Why is BGA (Ball Grid Array) socket not considered as an actual CPU socket? Anybody knows?
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