What is the use of thermal reliefs on vias for a copper pour?
My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
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My EDA software (PCAD, but I guess others do this too) adds thermal reliefs on vias in a copper pour. What’s the use? Vias aren’t soldered.
I have a batch of PCBs with SMT nuts which has been assembled onto a PCB – the nut has kapton tape on top to allow easy pickup for assembly.
My PCB manufacturer just informed me that he is facing PCB warpage issue in my simple, single sided, copper poured PCB. He says to avoid this issue he suggests to
We plan to visit factory next week. Could we know more about how many basic PCB testings in EMS field?
The assembly note states: Bake bare PCBs in a clean and well ventilated oven prior to assembly at 125*C for 24 hours. Why is this necessary?
Although the adsorption of moisture by FR4 is quite low, what is the best way to minimize it or eliminate it completely?
On a Flex Printed Circuit (FPC) made out of Kapton polyimide, will anything bad happen if I put a VIA in a part of the FPC that has to bend?
It is a nice looking breadboard, but the terminals are too loose to make a good connection on any components. so I couldn’t actually use them for anything.
We receive a batch of PCB with scratches from my supplier, but they think it is acceptable. I have never seen such error on even an B stock boards parts.
I receive the samples BOM of our PCBA factory. It remarks that PCB is FR4 Isola 370HR. What is this and is it reliable materials?
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