Put a machined guard around the pulse oximeter to keep the surface from it at about 0.2-0.3 (if it is and SMD part soldering height tolerance is about 0.2mm) and then simply screw down the resulting assembly.
Otherwise use weak springs to push the p.o. against the case, need to know the allowed stress on the body for that.
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#PCB Assembly
I want to put decoupling caps (0603) as close as possible to TQFP-48-7×7. So PCB/assembly wise how close I can put them (pad to pad, component to component)?
Does the ‘court yard’ need to be exactly square, or is it ok to place mentioned caps closer to TQFP in the corners where the TQFP pins leave kind of ‘free space’?
I am designing a PCB with 1088 pin BGA IC. Haven’t handle such a big IC. I am not sure the best amount of layer.
Does anyone know of if something exists like hold-down probes made of spring steel or piano wire, that would be small enough to hold down a component or package while soldering (without gluing it?) and thin enough to not get in the way of soldering small resistors or diodes?
Purchasers and engineers, especially those who have just set foot in this industry, will ask questions after receiving the PCB assembly quotation: What costs are included in
I’ve always been fascinated by the tiny electronic components that power our modern devices. As I’ve learned more about electronics, I discovered the world of
PCB and PCBA are the two most common terms in the electronics industry. Although the difference between them is only one letter, they represent different
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