Our PCB Thickness and Other Technical Parameters

Our PCB Thickness and Other Technical Parameters

Since 2006, MOKO Technology is specialized in the production of printed circuits and in express times. Depending on the PCB thickness or combination with other options, we manufacture in the best price range in the More Technology area (non-pool):

Best price range (pool):

0.80 mm, 1.00 mm, 1.55 mm and 2.40 mm material thickness
More technology (without pool):

0.50 mm, 0.80 mm, 1.00 mm, 1.55 mm, 2.00 mm, 2.40 mm and 3.20 mm material thickness

PCB thickness of different PCB board we can do

In addition to the configurations indicated on our site, we are also able to produce:

• Rigid circuits ranging from 16 to 32 layers
• Greater material and copper thicknesses
• HDI circuits; with laser drilling, blind and buried holes
• Flexible circuits from 6 to 10 layers
• Flex-rigid up to 12 layers, semi-flex
• Circuits with integrated resistors and capacitors
• More technical subjects: Arlon, Rogers, FR408HR, etc.

HDI Microvia printed circuit boards

At MOKO Technology we can offer you the following HDI Microvia material thicknesses, depending on the layer structure:

Layer structure 1-x-1 (4 layers in 0.50mm, 0.80mm, 1.00mm or 1.55mm material thickness and 6 and 8 layers in 1.00mm or 1.55mm material thickness) Layer structure 1-xb-1 (4, 6 and 8 layers in 1.00mm or 1.55mm material thickness)

Rigid-flex printed circuit boards

At MOKO Technology we offer the following PCB material thicknesses:

Layer structure 1F-1Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-3Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-5Ri: 1.00mm or 1.55mm material thickness
Printed circuit boards
Layer structure 1F-Ri including reinforcement 0.30mm Layer structure 2F-Ri including reinforcement 0.30mm
The FR4 reinforcement is only applied to one side of PCBs.

Please send us an inquiry using our inquiry form for printed circuit boards. We pass them on to the sales department.

Multi-layer printed circuit boards

ParameterDescription
Base materialFR2, FR3, FR4, CEM1, CEM3, others on request
Layers – numberMax. 22
Maximum board size480 x 580 mm, special: 584.2 x 1041.4 mm
Minimum PCB thickness0.1 mm
Maximum PCB thickness3.2 mm, special: 6.50 mm
Copper starches18 or 35 µm, especially: 9 µm, 210 µm, up to max. 350 µm
Minimum hole diameter0.2 mm (mechanically drilled)
Min. Track width100 µm
Min. Distance between conductor tracks100 µm
mechanical machiningscratch, mill
Surface finishCopper, HASL, chem. Nickel / Gold, Entek (OSP)
Solder stop masksDry film mask, UV-hardened solder resist, removable solder mask (in common colors)
Marking printingIn all catchy colors
Design optionsBond areas, SMD
other finishing optionsCarbon coating, hole metallization with silver

Lay-up Structure (example)

PCB thickness lay-up structure

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Our technical capacities for PCB manufacturing

To date, our team has the best equipment and technologies for the manufacture of high-quality PCB board. We are able to offer high volume PCB, also accept your prototype PCB.

Thanks to the equipment we have in our factory, we can offer you a very complete variety of options for your printed circuits. On this page, you will find all our capabilities and therefore, all the PCB that we are capable of producing.

Specification Our Standard CapacitiesOn Request
Number of layers 1 to 32 layers  up to 42 layers
Material thickness (SF and DF)0.2mm to 5.0mm<0.2mm or> 5.0mm
Multilayer material thickness0.35mm to 5.0mm <0.35mm or> 5.0mm
Tolerance on the thickness of the material If <1.0mm: +/- 0.1mm, if> 1.0mm: +/- 10%
Copper thickness, outer layer17, 35, 70, 105, 140, 175µm  210 to 350µm
Copper thickness, internal layer17, 35, 70, 105, 140, 175, 210µm
Type of base materialFR4, TG130 ° C, TG150 ° C, TG170 ° CTG200 ° C, TG230 ° C, Arlon, Teflon
FinishOSP, LF-HASL, chemical gold (ENIG), ENEPIG, silverHAL tin with a lead finish
Tin immersion thickness0.8 to 1.5µm
Lead-free HAL finish thickness≥ 0.4µm
HAL finish thickness with lead ≥ 0.4µm
On ENIG finish – nickel Ni thicknessfrom 3 to 5µm
On ENIG finish – Au gold thicknessfrom 0.025 to 0.127µm
On hard gold finish – nickel Ni thicknessfrom 3 to 5µm
On hard gold finish – Au gold thicknessfrom 0.125 to 1.3µm
Gold connection Yes
Maximum size for a PCB SF and DF546 x 1198mm
Maximum size for a multilayer PCB546 x 1198mm
The minimum size of a PCB10 x 10mm
The minimum size of a PCB on a 10 x 10mmblank
Minimum width of a PCB5mm
Blank with different types of circuitsYes
Half metalized hole at the edge of the cardYes
Metallization of the trancheYes
Filling copper viasYes
Electric testMobile probe if <3sqm with nail bed tester if> 3sqm
Plugging with copper (e.g. for via-in-pad)Yes
Peelable mask Belowbelow, the 2 sides
Carbon print / mini range to range distanceYes / 0.7mm
Chamfer at the edge of the card  Yes
Chamfer angle possible20 °, 25 °, 30 °, 45 °
Grooving jump Yes
Grooving depth tolerance+/- 0.075mm
Milling on the Z-axisYes, tolerance +/- 0.2mm
Milled holeYes
Special stacking for multilayer Yes
Minimum drilling 0.15mmOn requestfor> 10: 1
Mini pellet size on copper 35µm0.2mm larger than the via
Mini pellet size on copper 70µm & 105µm0.4mm more than via
Mini pellet size on copper 140µm & 210µm0.5mm more than the via
Possible drilling diameter0.2 to 6.3mm <0.2mm
Minimum gap between 2 holes (edge ​​to edge)0.125mm
Via buried mini (finished diameter)0.2mm 0.15mm
Via mini blind (finished diameter)0.2mm 0.15mm
Minimum cutting width0.8mm
Smallest interior angle (not metallic)  0.4mm
Internal milling; minimum width0.95mm
Track width and minimum space of 18µm0.076mm
Track width and minimum space on 35µm0.076mm
Track width and minimum space over 70µm0.178mm
Track width and minimum space over 105 µm 0.254 mm
Distance between copper and internal milling range0.20mm internal layers, 0.25mm external layers
Distance between the copper surface and card edge (milling)0.20mm internal layers, 0.25mm external layers
Distance mini copper range and board edge (V-cut)0.45mm
Savings varnish colorGreen, white, black, red, blue
Green savings varnish, minimum width0.1mm
Other color savings varnish, minimum width0.127mm
Green savings varnish, minimum width on a circular arc0.1mm
Green savings varnish, minimum distance from a copper range0.15mm more than copper
Savings varnish, text height smaller0.21mm
Screen printing colorBlack and white Yellow and red
Screen printing; smallest lineWidth: 0.1mm, height: 0.6mm
Screen printing; minimum space between 2 lines  0.1mm
Screen printing; minimum distance from a copper range0.05mm
Max offset of a hole compared to its reference0.075mm
Via metallized; tolerance (diameter up to 3mm)+/- 0.075mm
Via metallized; tolerance (diam above 3mm)+/- 0.075mm
Via non-metallic (diameter up to 6mm)+/- 0.05mm
Via non-metallic (diameter below 6mm) +/- 0.05mm
External dimension of the circuit / blank+/- 0.1mm
Flatness0.2% to 0.75%
Twist 0.2% to 0.75%
RoHS compliant base materialAnyUnless HAL with Pb is required!
Completion RoHS compliantAny
IPC standard adopted IPC-A-600G – Class 2, class 3
Base material UL compliantAny
DIN EN ISO 9001 certification  Yes
DIN EN ISO 14001 certificationYes
DIN EN ISO 16949 certification  Yes
Production time for SF and DF circuitsFrom 4 OJ (<1sqm) to 11 OJ (more than 10sqm) Express in 48H
Production time for circuits 4 to 8 layersFrom 6 OJ (<1sqm) to 14 OJ (more than 10sqm) Express in 48H
Production time for circuits 10 to 14 layersFrom 9 OJ (<1sqm) to 18 OJ (more than 10sqm)Express in 120H
Production time for circuits 16 to 24 layersFrom 12 OJ (<1sqm) to 24 OJ (more than 10sqm)Express in 150H

MOKO Technology has extensive PCB assembly mounting capabilities 

• Automated and manual fine pitch SMT.

• Multi-layer circuit boards, flex boards

• BGA with X-ray and rework function.

• Lead-free assembly

• Wave soldering

• Circuit test.

• Functional test.

• Protective varnish.

• Burn-in.

• Inline AOI inspection system

• XRAY inspection AOI test

94V0 PCBA manufacturing scalability up to

We combine advanced processes with highly qualified resources. With the leading, state-of-the-art technology and management system for PCB assembly

SMT process (RoHS compatible) up to:

1,0201 chip size
2. 12 mils (IC) pitch
3. Flip Chip (Controlled Collapse Chip Connection) – a distance of 5 mil
4. Quad Flat Package (QFP) – Pitch 12 mils

THT process (wave soldering process) (RoHS compliant) up to:

1.Single side wave soldering

2.SMT & THT mixing process

Base materialFR4production control of dataincluded
PCB thickness1-4 layers0.8 to 2.4 mm usage from one fileincluded
PCB thickness6 layersfrom 1.0 mm composition from different files50, – €
Copper structure35 μmDelivery of Gerber data for the solder paste stencil (on request)included
Smallest drilling diameter0.3 mmDelivery of the lasered solder paste stencil€ 240
Minimum track width0.1524 mm (6 mils)B-print€ 50 per side
Surface finishHot-Airlead-free E-testsee price list
Solder-resistone-sidedtwo-sided green UL marking (on request)included
Milling program with up to 24 changes of directionincludingmilling program with more than 24 changes of direction€ 50

 

A perfect result can only be achieved with your help:

CAD data in GERBER; Extended GERBER, Eagle, or TARGET3001!
Drill file in Excellon or SIEB & MEYER format
Delivery of your data by 9:00 a.m. if the calendar day should count as a working day.
Please separate the drilling data according to plated through and not plated through.
Indicate the frequency of each type of PCB on a panel and the number of different types on a PATCH PRINT.
Send only one file per layout level, which contains all types at once, even if you want more than one PCB of this type.
Send us a contour drawing for each variety.
The circuit boards are supplied individually and milled out.
Scoring benefits in the Galvano edge at no extra charge
If you want delivery in the benefit, your benefit arrangement must correspond to our general manufacturing possibilities and tolerances.
Only apertures up to max. Use 999 ml. Please fill larger ground areas according to standard.
If the stroke width of the writing in copper is <0.1524 mm or for B-printing <0.2 mm, no legibility can be guaranteed.

PCB manufacturing tolerances

External tolerances of multilayer structures
Printed circuit board manufacturers state a thickness tolerance of +/- 10%.

The built-up copper layer also has a tolerance of +/- 10%. This must be taken into account when calculating the track thickness.

The milling tolerances for external contours are +/- 0.1mm to a size of 100mm. From 100mm this can be up to +/- 0.2mm.

The thicker the material thickness of the multilayer, the more dimensionally stable the core / finished ML. The thicker the prepreg, the more dimensionally stable the fabric. The thinner the prepreg, the greater the resin content. The thicker the inner layer copper, the more or more resinous prepregs have to be used to fill the etched away copper surfaces.

If you need smaller tolerances due to the installation, we ask you to indicate this beforehand.

Tolerances of plated-through hole patterns (DK / PTH)
The diameter tolerance is specified with -0.05 / + 0.1mm.

The tolerances between the conductor pattern and the hole pattern are specified as follows:

Outer contour <30mm +/- 0.05mm
Outside contour <150mm +/- 0.1mm
Outer contour> 150mm +/- 0.15mm

Layer-thick paint
Please also note the layer thicknesses when painting when specifying PCB thickness.

The lacquer layer is typically between 40µm – 80µm thick. This thickness must be counted when specifying the PCB thickness. I.e. a PCB with a thickness of 1.5mm can be up to 1.73mm thick with tolerance and varnish.

Tolerances

The following diameter tolerances apply to metalized bores according to PERFAG *:

For non-metalized holes, the following diameter tolerances apply according to PERFAG *:

Nominal diameter d tolerance
d = <2.0 mm ± 0.10 mm
d> 2.0 / d = <5.3 mm ± 0.15 mm
d> 5.3 mm ± 0.20 mm
Nominal diameter d tolerance
d = <5.3 mm ± 0.05 mm
d> 5.3 mm ± 0.10 mm
Reductions
On request, we can also make countersinks on your circuit boards. The following information is required to countersink the circuit boards:

Hole diameter (DB)
Countersink Diameter (DS)
Lowering side (BS or LS)

Holes

Drilling diameter

All drill diameters from 0.15 mm in 0.05 mm steps can be manufactured (from drill diameter 2.0 mm in 0.1 mm steps). For drill diameters under 0.5 mm (= final diameter 0.4 mm), a surcharge will be added to the PCB costs. All holes are drilled 0.1 mm larger than specified in the tool list in order to comply with the hole tolerances (especially after metallization). If you have already taken this enlargement into account when creating the layout, this should be noted in the order. All holes (DK and NDK) should be combined in one drill file. Non-plated through holes (NDK) must be marked. You can find more information on this in the chapter Data formats.

Bores with a final diameter from 6.10 mm are nippled or milled.

The smallest drilling diameter depends on the PCB thickness, which is listed in the table below.

PCB thickness min. Hole diameter (finished hole diameter)
up to 1.0 mm 0.05 mm
> 1.0 to 1.6 mm 0.15 mm
> 1.6 mm to 2.0 mm 0.30 mm
> 2.0 mm to 2.4 mm 0.40 mm
> 2.4 mm to 3.2 mm 0.50 mm
Restraining rings for non-metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:

Remaining rings for metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:

The specified values ​​are minimum values, the largest possible residual ring should be aimed at in order to increase the functional reliability of the circuit board. A larger ring will result in a more secure solder joint.
Buried vias

Buried vias can be used to make connections between the inner layers that have no contact with the outer layers. The holes for each connection-level can either be defined as a separate tool in the drilling program or as a separate drill file.

Requested files for PCB assembly

— In order to provide you with the most efficient and accurate offer possible for the manufacture of the requested device, we ask you to provide us with the following information.
1. Gerber file, PCB file, Eagle file or CAD file are all allowed
2. A detailed parts list (BOM)
3. Clear pictures of PCB or PCBA examples for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Circuit diagram files for PCB design when a function test needs to be performed.
7. A sample, if available, for better procurement
8. CAD files for case manufacturing, if necessary
9. Complete wiring and assembly drawing with any special assembly instructions

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