Our PCB Thickness and Other Technical Parameters

Our PCB Thickness and Other Technical Parameters
Our PCB Thickness and Other Technical Parameters

Since 2006, MOKO Technology is specialized in the production of printed circuits and in express times. Depending on the PCB thickness or combination with other options, we manufacture in the best price range in the More Technology area (non-pool):

Best price range (pool):

0.80 mm, 1.00 mm, 1.55 mm and 2.40 mm material thickness
More technology (without pool):

0.50 mm, 0.80 mm, 1.00 mm, 1.55 mm, 2.00 mm, 2.40 mm and 3.20 mm material thickness

PCB thickness of different PCB board we can do

In addition to the configurations indicated on our site, we are also able to produce:

• Rigid circuits ranging from 16 to 32 layers
• Greater material and copper thicknesses
• HDI circuits; with laser drilling, blind and buried holes
• Flexible circuits from 6 to 10 layers
• Flex-rigid up to 12 layers, semi-flex
• Circuits with integrated resistors and capacitors
• More technical subjects: Arlon, Rogers, FR408HR, etc.

HDI Microvia printed circuit boards

At MOKO Technology we can offer you the following HDI Microvia material thicknesses, depending on the layer structure:

Layer structure 1-x-1 (4 layers in 0.50mm, 0.80mm, 1.00mm or 1.55mm material thickness and 6 and 8 layers in 1.00mm or 1.55mm material thickness) Layer structure 1-xb-1 (4, 6 and 8 layers in 1.00mm or 1.55mm material thickness)

Rigid-flex printed circuit boards

At MOKO Technology we offer the following PCB material thicknesses:

Layer structure 1F-1Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-3Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-5Ri: 1.00mm or 1.55mm material thickness
Printed circuit boards
Layer structure 1F-Ri including reinforcement 0.30mm Layer structure 2F-Ri including reinforcement 0.30mm
The FR4 reinforcement is only applied to one side of PCBs.

Please send us an inquiry using our inquiry form for printed circuit boards. We pass them on to the sales department.

Multi-layer printed circuit boards

Parameter Description
Base material FR2, FR3, FR4, CEM1, CEM3, others on request
Layers – number Max. 22
Maximum board size 480 x 580 mm, special: 584.2 x 1041.4 mm
Minimum PCB thickness 0.1 mm
Maximum PCB thickness 3.2 mm, special: 6.50 mm
Copper starches 18 or 35 µm, especially: 9 µm, 210 µm, up to max. 350 µm
Minimum hole diameter 0.2 mm (mechanically drilled)
Min. Track width 100 µm
Min. Distance between conductor tracks 100 µm
mechanical machining scratch, mill
Surface finish Copper, HASL, chem. Nickel / Gold, Entek (OSP)
Solder stop masks Dry film mask, UV-hardened solder resist, removable solder mask (in common colors)
Marking printing In all catchy colors
Design options Bond areas, SMD
other finishing options Carbon coating, hole metallization with silver

Lay-up Structure (example)

PCB thickness lay-up structure

Our technical capacities for PCB manufacturing

To date, our team has the best equipment and technologies for the manufacture of high-quality PCB board. We are able to offer high volume PCB, also accept your prototype PCB.

Thanks to the equipment we have in our factory, we can offer you a very complete variety of options for your printed circuits. On this page, you will find all our capabilities and therefore, all the PCB that we are capable of producing.

Specification  Our Standard Capacities On Request
Number of layers  1 to 32 layers   up to 42 layers
Material thickness (SF and DF) 0.2mm to 5.0mm <0.2mm or> 5.0mm
Multilayer material thickness 0.35mm to 5.0mm  <0.35mm or> 5.0mm
Tolerance on the thickness of the material  If <1.0mm: +/- 0.1mm, if> 1.0mm: +/- 10%
Copper thickness, outer layer 17, 35, 70, 105, 140, 175µm  210 to 350µm
Copper thickness, internal layer 17, 35, 70, 105, 140, 175, 210µm
Type of base material FR4, TG130 ° C, TG150 ° C, TG170 ° C TG200 ° C, TG230 ° C, Arlon, Teflon
Finish OSP, LF-HASL, chemical gold (ENIG), ENEPIG, silver HAL tin with a lead finish
Tin immersion thickness 0.8 to 1.5µm
Lead-free HAL finish thickness ≥ 0.4µm
HAL finish thickness with lead  ≥ 0.4µm
On ENIG finish – nickel Ni thickness from 3 to 5µm
On ENIG finish – Au gold thickness from 0.025 to 0.127µm
On hard gold finish – nickel Ni thickness from 3 to 5µm
On hard gold finish – Au gold thickness from 0.125 to 1.3µm
Gold connection  Yes
Maximum size for a PCB SF and DF 546 x 1198mm
Maximum size for a multilayer PCB 546 x 1198mm
The minimum size of a PCB 10 x 10mm
The minimum size of a PCB on a 10 x 10mm blank
Minimum width of a PCB 5mm
Blank with different types of circuits Yes
Half metalized hole at the edge of the card Yes
Metallization of the tranche Yes
Filling copper vias Yes
Electric test Mobile probe if <3sqm with nail bed tester if> 3sqm
Plugging with copper (e.g. for via-in-pad) Yes
Peelable mask Below below, the 2 sides
Carbon print / mini range to range distance Yes / 0.7mm
Chamfer at the edge of the card   Yes
Chamfer angle possible 20 °, 25 °, 30 °, 45 °
Grooving jump  Yes
Grooving depth tolerance +/- 0.075mm
Milling on the Z-axis Yes, tolerance +/- 0.2mm
Milled hole Yes
Special stacking for multilayer  Yes
Minimum drilling 0.15mm On request for> 10: 1
Mini pellet size on copper 35µm 0.2mm larger than the via
Mini pellet size on copper 70µm & 105µm 0.4mm more than via
Mini pellet size on copper 140µm & 210µm 0.5mm more than the via
Possible drilling diameter 0.2 to 6.3mm <0.2mm
Minimum gap between 2 holes (edge to edge) 0.125mm
Via buried mini (finished diameter) 0.2mm 0.15mm
Via mini blind (finished diameter) 0.2mm 0.15mm
Minimum cutting width 0.8mm
Smallest interior angle (not metallic)   0.4mm
Internal milling; minimum width 0.95mm
Track width and minimum space of 18µm 0.076mm
Track width and minimum space on 35µm 0.076mm
Track width and minimum space over 70µm 0.178mm
Track width and minimum space over 105 µm  0.254 mm
Distance between copper and internal milling range 0.20mm internal layers, 0.25mm external layers
Distance between the copper surface and card edge (milling) 0.20mm internal layers, 0.25mm external layers
Distance mini copper range and board edge (V-cut) 0.45mm
Savings varnish color Green, white, black, red, blue
Green savings varnish, minimum width 0.1mm
Other color savings varnish, minimum width 0.127mm
Green savings varnish, minimum width on a circular arc 0.1mm
Green savings varnish, minimum distance from a copper range 0.15mm more than copper
Savings varnish, text height smaller 0.21mm
Screen printing color Black and white  Yellow and red
Screen printing; smallest line Width: 0.1mm, height: 0.6mm
Screen printing; minimum space between 2 lines   0.1mm
Screen printing; minimum distance from a copper range 0.05mm
Max offset of a hole compared to its reference 0.075mm
Via metallized; tolerance (diameter up to 3mm) +/- 0.075mm
Via metallized; tolerance (diam above 3mm) +/- 0.075mm
Via non-metallic (diameter up to 6mm) +/- 0.05mm
Via non-metallic (diameter below 6mm)  +/- 0.05mm
External dimension of the circuit / blank +/- 0.1mm
Flatness 0.2% to 0.75%
Twist  0.2% to 0.75%
RoHS compliant base material Any Unless HAL with Pb is required!
Completion RoHS compliant Any
IPC standard adopted  IPC-A-600G – Class 2, class 3
Base material UL compliant Any
DIN EN ISO 9001 certification   Yes
DIN EN ISO 14001 certification Yes
DIN EN ISO 16949 certification   Yes
Production time for SF and DF circuits From 4 OJ (<1sqm) to 11 OJ (more than 10sqm)  Express in 48H
Production time for circuits 4 to 8 layers From 6 OJ (<1sqm) to 14 OJ (more than 10sqm)  Express in 48H
Production time for circuits 10 to 14 layers From 9 OJ (<1sqm) to 18 OJ (more than 10sqm) Express in 120H
Production time for circuits 16 to 24 layers From 12 OJ (<1sqm) to 24 OJ (more than 10sqm) Express in 150H

MOKO Technology has extensive PCB assembly mounting capabilities 

• Automated and manual fine pitch SMT.

• Multi-layer circuit boards, flex boards

• BGA with X-ray and rework function.

• Lead-free assembly

• Wave soldering

• Circuit test.

• Functional test.

• Protective varnish.

• Burn-in.

• Inline AOI inspection system

• XRAY inspection AOI test

94V0 PCBA manufacturing scalability up to

We combine advanced processes with highly qualified resources. With the leading, state-of-the-art technology and management system for PCB assembly

SMT process (RoHS compatible) up to:

1,0201 chip size
2. 12 mils (IC) pitch
3. Flip Chip (Controlled Collapse Chip Connection) – a distance of 5 mil
4. Quad Flat Package (QFP) – Pitch 12 mils

THT process (wave soldering process) (RoHS compliant) up to:

1.Single side wave soldering

2.SMT & THT mixing process

Base material FR4 production control of data included
PCB thickness 1-4 layers 0.8 to 2.4 mm usage from one file included
PCB thickness 6 layers from 1.0 mm composition from different files 50, – €
Copper structure 35 μm Delivery of Gerber data for the solder paste stencil (on request) included
Smallest drilling diameter 0.3 mm Delivery of the lasered solder paste stencil € 240
Minimum track width 0.1524 mm (6 mils) B-print € 50 per side
Surface finish Hot-Air lead-free E-test see price list
Solder-resist one-sided two-sided green UL marking (on request) included
Milling program with up to 24 changes of direction including milling program with more than 24 changes of direction € 50


A perfect result can only be achieved with your help:

CAD data in GERBER; Extended GERBER, Eagle, or TARGET3001!
Drill file in Excellon or SIEB & MEYER format
Delivery of your data by 9:00 a.m. if the calendar day should count as a working day.
Please separate the drilling data according to plated through and not plated through.
Indicate the frequency of each type of PCB on a panel and the number of different types on a PATCH PRINT.
Send only one file per layout level, which contains all types at once, even if you want more than one PCB of this type.
Send us a contour drawing for each variety.
The circuit boards are supplied individually and milled out.
Scoring benefits in the Galvano edge at no extra charge
If you want delivery in the benefit, your benefit arrangement must correspond to our general manufacturing possibilities and tolerances.
Only apertures up to max. Use 999 ml. Please fill larger ground areas according to standard.
If the stroke width of the writing in copper is <0.1524 mm or for B-printing <0.2 mm, no legibility can be guaranteed.

PCB manufacturing tolerances

External tolerances of multilayer structures
Printed circuit board manufacturers state a thickness tolerance of +/- 10%.

The built-up copper layer also has a tolerance of +/- 10%. This must be taken into account when calculating the track thickness.

The milling tolerances for external contours are +/- 0.1mm to a size of 100mm. From 100mm this can be up to +/- 0.2mm.

The thicker the material thickness of the multilayer, the more dimensionally stable the core / finished ML. The thicker the prepreg, the more dimensionally stable the fabric. The thinner the prepreg, the greater the resin content. The thicker the inner layer copper, the more or more resinous prepregs have to be used to fill the etched away copper surfaces.

If you need smaller tolerances due to the installation, we ask you to indicate this beforehand.

Tolerances of plated-through hole patterns (DK / PTH)
The diameter tolerance is specified with -0.05 / + 0.1mm.

The tolerances between the conductor pattern and the hole pattern are specified as follows:

Outer contour <30mm +/- 0.05mm
Outside contour <150mm +/- 0.1mm
Outer contour> 150mm +/- 0.15mm

Layer-thick paint
Please also note the layer thicknesses when painting when specifying PCB thickness.

The lacquer layer is typically between 40µm – 80µm thick. This thickness must be counted when specifying the PCB thickness. I.e. a PCB with a thickness of 1.5mm can be up to 1.73mm thick with tolerance and varnish.


The following diameter tolerances apply to metalized bores according to PERFAG *:

For non-metalized holes, the following diameter tolerances apply according to PERFAG *:

Nominal diameter d tolerance
d = <2.0 mm ± 0.10 mm
d> 2.0 / d = <5.3 mm ± 0.15 mm
d> 5.3 mm ± 0.20 mm
Nominal diameter d tolerance
d = <5.3 mm ± 0.05 mm
d> 5.3 mm ± 0.10 mm
On request, we can also make countersinks on your circuit boards. The following information is required to countersink the circuit boards:

Hole diameter (DB)
Countersink Diameter (DS)
Lowering side (BS or LS)


Drilling diameter

All drill diameters from 0.15 mm in 0.05 mm steps can be manufactured (from drill diameter 2.0 mm in 0.1 mm steps). For drill diameters under 0.5 mm (= final diameter 0.4 mm), a surcharge will be added to the PCB costs. All holes are drilled 0.1 mm larger than specified in the tool list in order to comply with the hole tolerances (especially after metallization). If you have already taken this enlargement into account when creating the layout, this should be noted in the order. All holes (DK and NDK) should be combined in one drill file. Non-plated through holes (NDK) must be marked. You can find more information on this in the chapter Data formats.

Bores with a final diameter from 6.10 mm are nippled or milled.

The smallest drilling diameter depends on the PCB thickness, which is listed in the table below.

PCB thickness min. Hole diameter (finished hole diameter)
up to 1.0 mm 0.05 mm
> 1.0 to 1.6 mm 0.15 mm
> 1.6 mm to 2.0 mm 0.30 mm
> 2.0 mm to 2.4 mm 0.40 mm
> 2.4 mm to 3.2 mm 0.50 mm
Restraining rings for non-metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:

Remaining rings for metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:

The specified values are minimum values, the largest possible residual ring should be aimed at in order to increase the functional reliability of the circuit board. A larger ring will result in a more secure solder joint.
Buried vias

Buried vias can be used to make connections between the inner layers that have no contact with the outer layers. The holes for each connection-level can either be defined as a separate tool in the drilling program or as a separate drill file.

Requested files for PCB assembly

— In order to provide you with the most efficient and accurate offer possible for the manufacture of the requested device, we ask you to provide us with the following information.
1. Gerber file, PCB file, Eagle file or CAD file are all allowed
2. A detailed parts list (BOM)
3. Clear pictures of PCB or PCBA examples for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Circuit diagram files for PCB design when a function test needs to be performed.
7. A sample, if available, for better procurement
8. CAD files for case manufacturing, if necessary
9. Complete wiring and assembly drawing with any special assembly instructions


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