Since 2006, MOKO Technology is specialized in the production of printed circuits and in express times. Depending on the PCB thickness or combination with other options, we manufacture in the best price range in the More Technology area (non-pool):
Best price range (pool):
0.80 mm, 1.00 mm, 1.55 mm and 2.40 mm material thickness
More technology (without pool):
0.50 mm, 0.80 mm, 1.00 mm, 1.55 mm, 2.00 mm, 2.40 mm and 3.20 mm material thickness
PCB thickness of different PCB board we can do
In addition to the configurations indicated on our site, we are also able to produce:
• Rigid circuits ranging from 16 to 32 layers
• Greater material and copper thicknesses
• HDI circuits; with laser drilling, blind and buried holes
• Flexible circuits from 6 to 10 layers
• Flex-rigid up to 12 layers, semi-flex
• Circuits with integrated resistors and capacitors
• More technical subjects: Arlon, Rogers, FR408HR, etc.
HDI Microvia printed circuit boards
At MOKO Technology we can offer you the following HDI Microvia material thicknesses, depending on the layer structure:
Layer structure 1-x-1 (4 layers in 0.50mm, 0.80mm, 1.00mm or 1.55mm material thickness and 6 and 8 layers in 1.00mm or 1.55mm material thickness) Layer structure 1-xb-1 (4, 6 and 8 layers in 1.00mm or 1.55mm material thickness)
Rigid-flex printed circuit boards
At MOKO Technology we offer the following PCB material thicknesses:
Layer structure 1F-1Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-3Ri: 1.00mm or 1.55mm material thickness Layer structure 1F-5Ri: 1.00mm or 1.55mm material thickness
Printed circuit boards
Layer structure 1F-Ri including reinforcement 0.30mm Layer structure 2F-Ri including reinforcement 0.30mm
The FR4 reinforcement is only applied to one side of PCBs.
Please send us an inquiry using our inquiry form for printed circuit boards. We pass them on to the sales department.
Multi-layer printed circuit boards
| Parameter | Description |
| Base material | FR2, FR3, FR4, CEM1, CEM3, others on request |
| Layers – number | Max. 22 |
| Maximum board size | 480 x 580 mm, special: 584.2 x 1041.4 mm |
| Minimum PCB thickness | 0.1 mm |
| Maximum PCB thickness | 3.2 mm, special: 6.50 mm |
| Copper starches | 18 or 35 µm, especially: 9 µm, 210 µm, up to max. 350 µm |
| Minimum hole diameter | 0.2 mm (mechanically drilled) |
| Min. Track width | 100 µm |
| Min. Distance between conductor tracks | 100 µm |
| mechanical machining | scratch, mill |
| Surface finish | Copper, HASL, chem. Nickel / Gold, Entek (OSP) |
| Solder stop masks | Dry film mask, UV-hardened solder resist, removable solder mask (in common colors) |
| Marking printing | In all catchy colors |
| Design options | Bond areas, SMD |
| other finishing options | Carbon coating, hole metallization with silver |
Lay-up Structure (example)
Our technical capacities for PCB manufacturing
To date, our team has the best equipment and technologies for the manufacture of high-quality PCB board. We are able to offer high volume PCB, also accept your prototype PCB.
Thanks to the equipment we have in our factory, we can offer you a very complete variety of options for your printed circuits. On this page, you will find all our capabilities and therefore, all the PCB that we are capable of producing.
| Specification | Our Standard Capacities | On Request |
| Number of layers | 1 to 32 layers | up to 42 layers |
| Material thickness (SF and DF) | 0.2mm to 5.0mm | <0.2mm or> 5.0mm |
| Multilayer material thickness | 0.35mm to 5.0mm | <0.35mm or> 5.0mm |
| Tolerance on the thickness of the material | If <1.0mm: +/- 0.1mm, if> 1.0mm: +/- 10% | |
| Copper thickness, outer layer | 17, 35, 70, 105, 140, 175µm 210 to 350µm | |
| Copper thickness, internal layer | 17, 35, 70, 105, 140, 175, 210µm | |
| Type of base material | FR4, TG130 ° C, TG150 ° C, TG170 ° C | TG200 ° C, TG230 ° C, Arlon, Teflon |
| Finish | OSP, LF-HASL, chemical gold (ENIG), ENEPIG, silver | HAL tin with a lead finish |
| Tin immersion thickness | 0.8 to 1.5µm | |
| Lead-free HAL finish thickness | ≥ 0.4µm | |
| HAL finish thickness with lead | ≥ 0.4µm | |
| On ENIG finish – nickel Ni thickness | from 3 to 5µm | |
| On ENIG finish – Au gold thickness | from 0.025 to 0.127µm | |
| On hard gold finish – nickel Ni thickness | from 3 to 5µm | |
| On hard gold finish – Au gold thickness | from 0.125 to 1.3µm | |
| Gold connection | Yes | |
| Maximum size for a PCB SF and DF | 546 x 1198mm | |
| Maximum size for a multilayer PCB | 546 x 1198mm | |
| The minimum size of a PCB | 10 x 10mm | |
| The minimum size of a PCB on a 10 x 10mm | blank | |
| Minimum width of a PCB | 5mm | |
| Blank with different types of circuits | Yes | |
| Half metalized hole at the edge of the card | Yes | |
| Metallization of the tranche | Yes | |
| Filling copper vias | Yes | |
| Electric test | Mobile probe if <3sqm with nail bed tester if> 3sqm | |
| Plugging with copper (e.g. for via-in-pad) | Yes | |
| Peelable mask Below | below, the 2 sides | |
| Carbon print / mini range to range distance | Yes / 0.7mm | |
| Chamfer at the edge of the card | Yes | |
| Chamfer angle possible | 20 °, 25 °, 30 °, 45 ° | |
| Grooving jump | Yes | |
| Grooving depth tolerance | +/- 0.075mm | |
| Milling on the Z-axis | Yes, tolerance +/- 0.2mm | |
| Milled hole | Yes | |
| Special stacking for multilayer | Yes | |
| Minimum drilling 0.15mm | On request | for> 10: 1 |
| Mini pellet size on copper 35µm | 0.2mm larger than the via | |
| Mini pellet size on copper 70µm & 105µm | 0.4mm more than via | |
| Mini pellet size on copper 140µm & 210µm | 0.5mm more than the via | |
| Possible drilling diameter | 0.2 to 6.3mm <0.2mm | |
| Minimum gap between 2 holes (edge to edge) | 0.125mm | |
| Via buried mini (finished diameter) | 0.2mm 0.15mm | |
| Via mini blind (finished diameter) | 0.2mm 0.15mm | |
| Minimum cutting width | 0.8mm | |
| Smallest interior angle (not metallic) | 0.4mm | |
| Internal milling; minimum width | 0.95mm | |
| Track width and minimum space of 18µm | 0.076mm | |
| Track width and minimum space on 35µm | 0.076mm | |
| Track width and minimum space over 70µm | 0.178mm | |
| Track width and minimum space over 105 µm | 0.254 mm | |
| Distance between copper and internal milling range | 0.20mm internal layers, 0.25mm external layers | |
| Distance between the copper surface and card edge (milling) | 0.20mm internal layers, 0.25mm external layers | |
| Distance mini copper range and board edge (V-cut) | 0.45mm | |
| Savings varnish color | Green, white, black, red, blue | |
| Green savings varnish, minimum width | 0.1mm | |
| Other color savings varnish, minimum width | 0.127mm | |
| Green savings varnish, minimum width on a circular arc | 0.1mm | |
| Green savings varnish, minimum distance from a copper range | 0.15mm more than copper | |
| Savings varnish, text height smaller | 0.21mm | |
| Screen printing color | Black and white | Yellow and red |
| Screen printing; smallest line | Width: 0.1mm, height: 0.6mm | |
| Screen printing; minimum space between 2 lines | 0.1mm | |
| Screen printing; minimum distance from a copper range | 0.05mm | |
| Max offset of a hole compared to its reference | 0.075mm | |
| Via metallized; tolerance (diameter up to 3mm) | +/- 0.075mm | |
| Via metallized; tolerance (diam above 3mm) | +/- 0.075mm | |
| Via non-metallic (diameter up to 6mm) | +/- 0.05mm | |
| Via non-metallic (diameter below 6mm) | +/- 0.05mm | |
| External dimension of the circuit / blank | +/- 0.1mm | |
| Flatness | 0.2% to 0.75% | |
| Twist | 0.2% to 0.75% | |
| RoHS compliant base material | Any | Unless HAL with Pb is required! |
| Completion RoHS compliant | Any | |
| IPC standard adopted | IPC-A-600G – Class 2, class 3 | |
| Base material UL compliant | Any | |
| DIN EN ISO 9001 certification | Yes | |
| DIN EN ISO 14001 certification | Yes | |
| DIN EN ISO 16949 certification | Yes | |
| Production time for SF and DF circuits | From 4 OJ (<1sqm) to 11 OJ (more than 10sqm) | Express in 48H |
| Production time for circuits 4 to 8 layers | From 6 OJ (<1sqm) to 14 OJ (more than 10sqm) | Express in 48H |
| Production time for circuits 10 to 14 layers | From 9 OJ (<1sqm) to 18 OJ (more than 10sqm) | Express in 120H |
| Production time for circuits 16 to 24 layers | From 12 OJ (<1sqm) to 24 OJ (more than 10sqm) | Express in 150H |
MOKO Technology has extensive PCB assembly mounting capabilities
• Automated and manual fine pitch SMT.
• Multi-layer circuit boards, flex boards
• BGA with X-ray and rework function.
• Lead-free assembly
• Wave soldering
• Circuit test.
• Functional test.
• Protective varnish.
• Burn-in.
• Inline AOI inspection system
• XRAY inspection AOI test
94V0 PCBA manufacturing scalability up to
We combine advanced processes with highly qualified resources. With the leading, state-of-the-art technology and management system for PCB assembly
SMT process (RoHS compatible) up to:
1,0201 chip size
2. 12 mils (IC) pitch
3. Flip Chip (Controlled Collapse Chip Connection) – a distance of 5 mil
4. Quad Flat Package (QFP) – Pitch 12 mils
THT process (wave soldering process) (RoHS compliant) up to:
1.Single side wave soldering
2.SMT & THT mixing process
| Base material | FR4 | production control of data | included |
| PCB thickness | 1-4 layers | 0.8 to 2.4 mm usage from one file | included |
| PCB thickness | 6 layers | from 1.0 mm composition from different files | 50, – € |
| Copper structure | 35 μm | Delivery of Gerber data for the solder paste stencil (on request) | included |
| Smallest drilling diameter | 0.3 mm | Delivery of the lasered solder paste stencil | € 240 |
| Minimum track width | 0.1524 mm (6 mils) | B-print | € 50 per side |
| Surface finish | Hot-Air | lead-free E-test | see price list |
| Solder-resist | one-sided | two-sided green UL marking (on request) | included |
| Milling program with up to 24 changes of direction | including | milling program with more than 24 changes of direction | € 50
|
A perfect result can only be achieved with your help:
CAD data in GERBER; Extended GERBER, Eagle, or TARGET3001!
Drill file in Excellon or SIEB & MEYER format
Delivery of your data by 9:00 a.m. if the calendar day should count as a working day.
Please separate the drilling data according to plated through and not plated through.
Indicate the frequency of each type of PCB on a panel and the number of different types on a PATCH PRINT.
Send only one file per layout level, which contains all types at once, even if you want more than one PCB of this type.
Send us a contour drawing for each variety.
The circuit boards are supplied individually and milled out.
Scoring benefits in the Galvano edge at no extra charge
If you want delivery in the benefit, your benefit arrangement must correspond to our general manufacturing possibilities and tolerances.
Only apertures up to max. Use 999 ml. Please fill larger ground areas according to standard.
If the stroke width of the writing in copper is <0.1524 mm or for B-printing <0.2 mm, no legibility can be guaranteed.
PCB manufacturing tolerances
External tolerances of multilayer structures
Printed circuit board manufacturers state a thickness tolerance of +/- 10%.
The built-up copper layer also has a tolerance of +/- 10%. This must be taken into account when calculating the track thickness.
The milling tolerances for external contours are +/- 0.1mm to a size of 100mm. From 100mm this can be up to +/- 0.2mm.
The thicker the material thickness of the multilayer, the more dimensionally stable the core / finished ML. The thicker the prepreg, the more dimensionally stable the fabric. The thinner the prepreg, the greater the resin content. The thicker the inner layer copper, the more or more resinous prepregs have to be used to fill the etched away copper surfaces.
If you need smaller tolerances due to the installation, we ask you to indicate this beforehand.
Tolerances of plated-through hole patterns (DK / PTH)
The diameter tolerance is specified with -0.05 / + 0.1mm.
The tolerances between the conductor pattern and the hole pattern are specified as follows:
Outer contour <30mm +/- 0.05mm
Outside contour <150mm +/- 0.1mm
Outer contour> 150mm +/- 0.15mm
Layer-thick paint
Please also note the layer thicknesses when painting when specifying PCB thickness.
The lacquer layer is typically between 40µm – 80µm thick. This thickness must be counted when specifying the PCB thickness. I.e. a PCB with a thickness of 1.5mm can be up to 1.73mm thick with tolerance and varnish.
Tolerances
The following diameter tolerances apply to metalized bores according to PERFAG *:
For non-metalized holes, the following diameter tolerances apply according to PERFAG *:
Nominal diameter d tolerance
d = <2.0 mm ± 0.10 mm
d> 2.0 / d = <5.3 mm ± 0.15 mm
d> 5.3 mm ± 0.20 mm
Nominal diameter d tolerance
d = <5.3 mm ± 0.05 mm
d> 5.3 mm ± 0.10 mm
Reductions
On request, we can also make countersinks on your circuit boards. The following information is required to countersink the circuit boards:
Hole diameter (DB)
Countersink Diameter (DS)
Lowering side (BS or LS)
Holes
Drilling diameter
All drill diameters from 0.15 mm in 0.05 mm steps can be manufactured (from drill diameter 2.0 mm in 0.1 mm steps). For drill diameters under 0.5 mm (= final diameter 0.4 mm), a surcharge will be added to the PCB costs. All holes are drilled 0.1 mm larger than specified in the tool list in order to comply with the hole tolerances (especially after metallization). If you have already taken this enlargement into account when creating the layout, this should be noted in the order. All holes (DK and NDK) should be combined in one drill file. Non-plated through holes (NDK) must be marked. You can find more information on this in the chapter Data formats.
Bores with a final diameter from 6.10 mm are nippled or milled.
The smallest drilling diameter depends on the PCB thickness, which is listed in the table below.
PCB thickness min. Hole diameter (finished hole diameter)
up to 1.0 mm 0.05 mm
> 1.0 to 1.6 mm 0.15 mm
> 1.6 mm to 2.0 mm 0.30 mm
> 2.0 mm to 2.4 mm 0.40 mm
> 2.4 mm to 3.2 mm 0.50 mm
Restraining rings for non-metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:
Remaining rings for metalized holes
In order to ensure a circumferential ring around the holes, the following parameters must be observed in the layout according to PERFAG *:
The specified values are minimum values, the largest possible residual ring should be aimed at in order to increase the functional reliability of the circuit board. A larger ring will result in a more secure solder joint.
Buried vias
Buried vias can be used to make connections between the inner layers that have no contact with the outer layers. The holes for each connection-level can either be defined as a separate tool in the drilling program or as a separate drill file.
Requested files for PCB assembly
— In order to provide you with the most efficient and accurate offer possible for the manufacture of the requested device, we ask you to provide us with the following information.
1. Gerber file, PCB file, Eagle file or CAD file are all allowed
2. A detailed parts list (BOM)
3. Clear pictures of PCB or PCBA examples for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Circuit diagram files for PCB design when a function test needs to be performed.
7. A sample, if available, for better procurement
8. CAD files for case manufacturing, if necessary
9. Complete wiring and assembly drawing with any special assembly instructions