Fly probe test is a better testing approach than the manual test. When inspecting the PCBA circuit board, the probe head contacts the circuit board and electronic components quickly and frequently.
Because the test probe is in physical contact with the solder on the pass hole and the test pad, small pits may be left in the solder. For some OEM customers, these small pits may be considered as bad appearance.
However, some high-end flying needle test equipment have developed new technology, named soft landing technology. It can avoid leaving obvious pits on the solder and even can be tested on the ceramic sheet.