PCB Assembly

How do PCB manufacturers prevent solder from entering vias during wave soldering?

Choose the right flux. There are many reasons for welding balls, but flux is the main reason.

Generally speaking, fluxes with low solid content tend to form solder balls when the underside SMD elements require double PCBA wave soldering. Because these additives are not designed to be used for long periods of time. If the flux sprayed on the PCB has been used up after the first wave crest, there is no flux after two peaks. Thus, it cannot play the function of flux and help reduce tin balls.

One of the main ways to reduce the number of welding balls is to choose a flux that can withstand longer periods of heat.

Read More: Mastering Selective Soldering: A Comprehensive Guide

#PCB Assembly

Oliver Smith

Oliver is an experienced electronics engineer skilled in PCB design, analog circuits, embedded systems, and prototyping. His deep knowledge spans schematic capture, firmware coding, simulation, layout, testing, and troubleshooting. Oliver excels at taking projects from concept to mass production using his electrical design talents and mechanical aptitude.

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