Yes. Hot air solder leveling works fine for plating through holes, even large holes, I see no reason for it not to work with castelation. It does somewhat bind you to a solder chemistry, (lead or lead-free) and also has a shorter shelf-life than ENIG.
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A triangular tiling would allow π⁄√12 or 90.69% of the footprint to be reserved for the solder balls and the surrounding clearance, while the ubiquitous square tiling only allows π/4 or 78.54% of the footprint to be used. Why are there no BGA chips with triangular tessellation?
E: The prototype provided by the supplier is good, but I found some solder joints are close to the PCB. Actually, how much width would be better?
What would be the average speed of assembling surface mount components on to a PCB for an experienced person? Assuming they have desk that is correctly set up (pick and place station) and the PCB has solder paste already applied.
SMT PCB assembly has become the most popular PCB assembly technology since the 1980s, and is now widely used in industries such as consumer electronics,
PCB assembly refers to the process of assembling all electronic components such as resistors, transistors, diodes, etc. onto a printed circuit board, and the assembly
Maintaining high speed PCB design quality from the driver to the collector on the PCB is not an easy task. One of the most testing
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