Yes. Hot air solder leveling works fine for plating through holes, even large holes, I see no reason for it not to work with castelation. It does somewhat bind you to a solder chemistry, (lead or lead-free) and also has a shorter shelf-life than ENIG.
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I have received the final prototypes from manufacturer and all is good after our checking. And we want to keep it well. Do you have any tips about that?
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